How digital-first enterprises are evolving from efficiency to intelligence

India, Dec. 1 -- Every era of enterprise evolution has been defined by a single pursuit, to do more with less. The past decade belonged to digital efficiency. Automation accelerated workflows, cloud i... Read More

Agileo Automation Agil'SECS-II to enable semiconductor OEMs, multi-industry fabs, and labs

India, Dec. 1 -- Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, unveiled Agil'SECS-II at SEMICON Europa 2025. This new SECS-II lib... Read More

SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin

India, Dec. 1 -- Siemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of automotive architectures ... Read More

GoI democratizing chip design among Indian Universities with access to industry-grade EDA tools and MPW fab services

India, Dec. 1 -- Union Minister for Electronics & Information Technology, Shri Ashwini Vaishnaw, handed over 28 chips fabricated at Semiconductor Laboratory (SCL) Mohali, including 600 bare dies and 6... Read More

10 key tech trends that will define industry's evolution in 2026: TrendForce

India, Dec. 1 -- TrendForce has identified 10 key technology trends that will define the tech industry's evolution in 2026. The highlights of these findings are outlined below: AI chip competition in... Read More

Next-Gen HPE Cray Platform Powers Scalable AI Workloads

India, Nov. 28 -- HPE has announced newest additions to the next-generation HPE Cray supercomputing portfolio that provide industry-leading compute density designed to meet the needs of artificial int... Read More

Synopsys demos framework for optimizing manufacturing processes with Digital Twins @ Microsoft Ignite

India, Nov. 28 -- Synopsys Inc., alongside technical collaborators at Microsoft Ignite, today unveiled a simulation-driven framework for optimizing dynamic manufacturing processes in real time. First... Read More

Rubin's cableless architecture and ASIC high-layer HDI designs push PCBs to center of AI compute power

India, Nov. 28 -- TrendForce's latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA's Rubin platform featuring a fully cableless architecture, to ... Read More

Glass materials key for semiconductor manufacturing

India, Nov. 28 -- Yole Group released its new technology & market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic m... Read More

Global DRAM Revenue Jumps 30.9% in 3Q25; Micron's market share climbs by 3.7%

India, Nov. 28 -- TrendForce's latest research shows that significant increases in conventional DRAM contract prices, higher bit shipments, and growing HBM volumes drove the global DRAM industry reven... Read More

• «
• 1
• 2
• 3
• 4
• 5
• 6
• 7
• 8
• 9
• 10
• »
• »»